1SX210HU2F50E2VG Intel
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1SX210HU2F50E2VG Intel
Артикул 1SX210HU2F50E2VG Intel
Описание
Manufacturer: Intel
Manufacturer PN: 1SX210HU2F50E2VG
Description: IC FPGA STRATIX 10 2397FBGA
Detailed Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ System On Chip (SOC) IC Stratix® 10 SX FPGA - 2100K Logic Elements 1.5GHz 2397-FBGA, FC (50x50)
Package: 20-VFQFN Exposed Pad
Mfr: Diodes Incorporated
Series: PCI Express® (PCIe)
Applications: PCI Express®
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: -
Number of Channels: 2
On-State Resistance (Max): -
Voltage - Supply, Single (V+): 3V ~ 3.6V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 8.1GHz
Features: Bi-Directional, SATA, USB 3.0
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Supplier Device Package: 20-QFN (2.5x4.5)
Base Product Number: PI3PCIE3212
Manufacturer PN: 1SX210HU2F50E2VG
Description: IC FPGA STRATIX 10 2397FBGA
Detailed Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ System On Chip (SOC) IC Stratix® 10 SX FPGA - 2100K Logic Elements 1.5GHz 2397-FBGA, FC (50x50)
Package: 20-VFQFN Exposed Pad
Mfr: Diodes Incorporated
Series: PCI Express® (PCIe)
Applications: PCI Express®
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: -
Number of Channels: 2
On-State Resistance (Max): -
Voltage - Supply, Single (V+): 3V ~ 3.6V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 8.1GHz
Features: Bi-Directional, SATA, USB 3.0
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Supplier Device Package: 20-QFN (2.5x4.5)
Base Product Number: PI3PCIE3212
Техническая документация
