10AS066H3F34I3SGES Intel
10AS066H3F34I3SGES Intel
Артикул 10AS066H3F34I3SGES Intel
Описание
Manufacturer: Intel
Manufacturer PN: 10AS066H3F34I3SGES
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Detailed Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 660K Logic Elements 1.5GHz 1152-FBGA, FC (35x35)
Package: 20-VFQFN Exposed Pad
Mfr: Diodes Incorporated
Series: PCI Express® (PCIe)
Applications: PCI Express®
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: -
Number of Channels: 2
On-State Resistance (Max): -
Voltage - Supply, Single (V+): 3V ~ 3.6V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 8.1GHz
Features: Bi-Directional, SATA, USB 3.0
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Supplier Device Package: 20-QFN (2.5x4.5)
Base Product Number: PI3PCIE3212
Manufacturer PN: 10AS066H3F34I3SGES
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Detailed Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 660K Logic Elements 1.5GHz 1152-FBGA, FC (35x35)
Package: 20-VFQFN Exposed Pad
Mfr: Diodes Incorporated
Series: PCI Express® (PCIe)
Applications: PCI Express®
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: -
Number of Channels: 2
On-State Resistance (Max): -
Voltage - Supply, Single (V+): 3V ~ 3.6V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 8.1GHz
Features: Bi-Directional, SATA, USB 3.0
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-VFQFN Exposed Pad
Supplier Device Package: 20-QFN (2.5x4.5)
Base Product Number: PI3PCIE3212
Техническая документация
