S1C17W22D101100 Epson Electronics America Inc-Semiconductor Div
S1C17W22D101100 Epson Electronics America Inc-Semiconductor Div
Артикул S1C17W22D101100 Epson Electronics America Inc-Semiconductor Div
Описание
Manufacturer: Epson Electronics America Inc-Semiconductor Div
Manufacturer PN: S1C17W22D101100
Description: IC MCU 16BIT 64KB FLASH DIE
Detailed Description: S1C17 - Microcontroller IC 16-Bit 4.2MHz 64KB (64K x 8) FLASH Die
Package: 30-LSSOP (0.240", 6.10mm Width)
Mfr: Renesas Electronics America Inc
Series: RL78/G12
Digi-Key Programmable: Not Verified
Core Processor: RL78
Core Size: 16-Bit
Speed: 24MHz
Connectivity: CSI, I²C, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 8x8/10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 30-LSSOP (0.240", 6.10mm Width)
Supplier Device Package: 30-LSSOP
Base Product Number: R5F103
Manufacturer PN: S1C17W22D101100
Description: IC MCU 16BIT 64KB FLASH DIE
Detailed Description: S1C17 - Microcontroller IC 16-Bit 4.2MHz 64KB (64K x 8) FLASH Die
Package: 30-LSSOP (0.240", 6.10mm Width)
Mfr: Renesas Electronics America Inc
Series: RL78/G12
Digi-Key Programmable: Not Verified
Core Processor: RL78
Core Size: 16-Bit
Speed: 24MHz
Connectivity: CSI, I²C, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 8x8/10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 30-LSSOP (0.240", 6.10mm Width)
Supplier Device Package: 30-LSSOP
Base Product Number: R5F103
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